At this year’s event, Dymax will showcase adhesive and curing solutions for catheter assembly and other medical device manufacturing applications, including technologies for precision bonding, cure validation, and curing in hard-to-reach areas.

Featured products include:

• CTH-Series adhesives provide strong adhesion, flexibility, and rapid light curing for reliable, low-stress catheter assembly.
• HLC™ adhesives combine light curing with moisture/contact cure capabilities to ensure reliable curing in dark or shadowed areas and complex assemblies.
• Encompass® technology incorporates both See-Cure color-change functionality and Ultra-Red® fluorescence in a single adhesive to simplify cure verification and bond-line inspection.
• Curing systems, including the BlueWave® QX4 V2.0 LED spot curing system, deliver controlled and repeatable curing performance for demanding medical manufacturing environments.

“Medical device manufacturers continue to look for opportunities to increase productivity while maintaining the highest quality standards,” said Michelle Evanoski, Global Medical Business Development Lead, at Dymax. “The pace of innovation in medical device design continues to accelerate, creating new assembly and process challenges. We look forward to meeting with manufacturers to discuss how material and curing technologies can help support these evolving requirements.”