Finetech, a leading provider of precision bonders and advanced rework equipment, announces the latest addition to the FINEPLACER® family, the FINEPLACER® femtoblu die bonding system. This automated micro assembly cell is an efficient and economical solution for dedicated photonics production. These demanding applications will benefit from a placement accuracy of 2.0 µm @ 3 Sigma and ultra-low force bonding capability down to 0.05 […]
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